The official visit of the IT Park Uzbekistan delegation to Hong Kong and Shanghai concluded with the signing of several cooperation agreements with leading Chinese innovation organizations. Among the key outcomes was the signing of a Memorandum of Understanding (MoU) between IT Park Uzbekistan and Hong Kong Shenzhen Innovation and Technology Park (HSITP), establishing a framework for collaboration in innovation, startup development, technology commercialization, investment promotion, and international market expansion.

Earlier during the visit, the IT Park Uzbekistan delegation, led by Azamat Karamatov, CEO of IT Park Uzbekistan, held high-level discussions with the HSITP leadership headed by Vincent Ma, CEO of HSITP. The delegation also toured the park's innovation infrastructure, including the Visitor Centre and the talent accommodation facilities, while presenting Uzbekistan's growing potential as a regional technology hub for international companies.

The signed Memorandum outlines cooperation across several strategic areas, including innovation and startup development, technology commercialization, investment attraction, and expanding international market access for technology companies.
Under the agreement, the parties intend to:
The signing of the Memorandum marks an important milestone in strengthening the partnership between IT Park Uzbekistan and HSITP, creating new opportunities for technology companies from both sides to expand internationally, attract investment, and foster cross-border innovation collaboration.
2026-07-18