IT Park Uzbekistan and TusPark (Jiangsu) Innovation Research Institute Discuss Startup Support and Technological Cooperation

Representatives of IT Park Uzbekistan, led by Deputy Director for Strategic Development Makhliyo Muksinova, held talks with a delegation from TusPark (Jiangsu) Innovation Research Institute, one of China’s largest operators of innovation infrastructure. The meeting took place as part of the Tashkent International Investment Forum (TIIF), currently being held in the capital of Uzbekistan.

TusPark (Jiangsu) Innovation Research Institute was represented by its Managing Director, Hao Tang.

During the meeting, the parties discussed prospects for cooperation in the fields of innovation, investment, artificial intelligence, and the development of technological ecosystems.

Particular attention was given to supporting startups and technology companies from both countries. The parties explored the possibility of creating support mechanisms to facilitate the entry of Uzbek startups into the Chinese market, as well as assisting Chinese startups and technology companies in launching projects in Uzbekistan. In addition, the participants discussed opportunities for investment cooperation and strengthening ties between the innovation ecosystems of the two countries.

Another key topic of discussion was collaboration in the areas of artificial intelligence, research and development (R&D), and the implementation of advanced technologies.

Following the meeting, the parties agreed to continue their dialogue on the implementation of joint initiatives aimed at supporting innovation, attracting investment, and creating new opportunities for technology companies in Uzbekistan and China.

The development of cooperation with TusPark (Jiangsu) Innovation Research Institute will enable IT Park Uzbekistan to strengthen ties with one of China’s largest innovation ecosystems, expand opportunities for Uzbek startups to enter international markets, and attract new investments into the country’s technology sector. Furthermore, the partnership will create additional opportunities for implementing joint projects in the fields of artificial intelligence, research and development, and semiconductor technologies.